Product novelty 31. May 2024
HIGH PRECISION PLATING developed by Gerweck GmbH Oberflächentechnik
Controlled Dip Technology
Performance deficits of standard immersion dip cells get improved by our new developed OVER CROSS cell design. Due to the reduction of the electrolyte meniscus in the plating cell, a very low tolerance in plating length can get ensured, even at higher plating speeds. Uniform thickness distribution leads to reduced amounts of precious metals.
Our innovative KAMµ cell design is an own develop, improved modification of an immersion dip technology for selective plating. The KAMµ technology with a specific masking system ensures an accurate plating length tolerance. The masking system makes it perfectly suitable for plating of female contacts due to the improved thickness ration between outside and inside of the contact.
The WAVE cell developed by Gerweck is a specific designed tool for single side plating of non-stamped strips. The flooding system ensures high selectivity on single side of the material without additional masking.
Selective Plated Stripes
Performance deficits of stationary brush modules get improved by our new developed µCRO BRUSH design. The rotating brush ensures a continued electrolyte exchange at the cathode (strip) material to ensure high plating speeds. The specific design of the tool enables very accurate plating tolerances which leads to reduced precious metals consumptions.
Our state of the art CRISP-Cells (Cost Reduced Intelligent Selective Plating) are further improvements of the standard wheel technologies. Massive masking wheel instead of a sensitive and not wear resistant rubber belt ensures less wear abrasion and therefore it can be used for a wide range of materials.
CRISP Spot technology allows free positioning of single and multiple selective spot areas easily. Our CRISP Spot technique enables very accurate plating tolerances of less than 0.5 mm. Process costs are reduced and plating speeds get increased which leads to cost savings.
Performance deficits of standard immersion dip cells get improved by our new developed OVER CROSS cell design. Due to the reduction of the electrolyte meniscus in the plating cell, a very low tolerance in plating length can get ensured, even at higher plating speeds. Uniform thickness distribution leads to reduced amounts of precious metals.
Our innovative KAMµ cell design is an own develop, improved modification of an immersion dip technology for selective plating. The KAMµ technology with a specific masking system ensures an accurate plating length tolerance. The masking system makes it perfectly suitable for plating of female contacts due to the improved thickness ration between outside and inside of the contact.
The WAVE cell developed by Gerweck is a specific designed tool for single side plating of non-stamped strips. The flooding system ensures high selectivity on single side of the material without additional masking.
Selective Plated Stripes
Performance deficits of stationary brush modules get improved by our new developed µCRO BRUSH design. The rotating brush ensures a continued electrolyte exchange at the cathode (strip) material to ensure high plating speeds. The specific design of the tool enables very accurate plating tolerances which leads to reduced precious metals consumptions.
Our state of the art CRISP-Cells (Cost Reduced Intelligent Selective Plating) are further improvements of the standard wheel technologies. Massive masking wheel instead of a sensitive and not wear resistant rubber belt ensures less wear abrasion and therefore it can be used for a wide range of materials.
CRISP Spot technology allows free positioning of single and multiple selective spot areas easily. Our CRISP Spot technique enables very accurate plating tolerances of less than 0.5 mm. Process costs are reduced and plating speeds get increased which leads to cost savings.
Gerweck GmbH
Oberflächentechnik
Contact
Mr. Martin Luger