Trade fair highlight 31. May 2024

Indium plating technology for press fit applications. Gerweck

Indium plating technology for press fit applications.
Gerweck‘s own developed indium plating system GOpressIN significantly reduces the tendency of whisker development and therefore it is perfectly suitable for all kinds of press fit contacts.

The fine-grained indium layer is characterized by high purity and therefore it provides a very low whisker formation, even under mechanical stress. Specially developed test methods enable to monitor the process and layer properties frequently.

The high quality GOpressIn indium layer is deposited by an own developed indium process. Due to the highly constant insertion- and pull-out forces GOpressIN is the perfect finishing process for high reliable low whiskering press fit applications.

GOpressIn delivers sating bright deposits of high purity indium. The surface is available without and with reflow processes to add additional superior properties.

Since January 2024 the GOpressIN technology is also in use at the Gerweck GmbH Surface Technology's production facilities. Of course, GOpressIN is also available in our prototype system, so sections of strips up to 400mm can also be selective or all-over plated with GOpressIN.

Features and Benefits
• significant reduced whisker development by indium.
• highly pure, high quality indium deposition
• perfectly suitable indium electrolyte by own development
• constant insertion- and pull out forces
• available with and without reflow
• uniform satin bright deposits

You want to know more about GOpressIN technology or you want to get prototypes plated with GOpressIN.
Do not hesitate to contact us: GOpressIN@gerweck-gmbh.de